The Frequency Response Effects of Internal Component Configuration on Multiple Ceramic Dielectric System
Written By: S. Pala | R. Demcko | M. Berolini
Abstract:
The purpose of this paper is to discuss the frequency response effects of internal designs within ceramic systems. Those effects will be related to component performance parameters for devices used to suppress ESD and control EMI in high speed data lines, which are prone to be damaged by ESD. As communication speed increase, systems become more complicated and performance standards tighten, options to improve EMI/RFI performance becomes of great importance. Long term EMI performance and reliability are of particular importance in automotive, medical and aviation application sectors. A performance comparison will be made between single element traditional MLCC and MLV SMT devices. A second comparison will be made between 3 terminal MLCC filters and 3 terminal MLV filters using doped ZnO dielectrics. Internal designs to expand the MLVs frequency response (to higher and lower frequencies) will be presented. These range from lumping MLV/MLCCs in a single package to expand MLV frequency response to the use of non overlap electrodes to minimize internal device capacitance. The impact of sub pf MLVs will be shown through the use of eye diagrams.
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The purpose of this paper is to discuss the frequency response effects of internal designs within ceramic systems. Those effects will be related to component performance parameters for devices used to suppress ESD and control EMI in high speed data lines, which are prone to be damaged by ESD. As communication speed increase, systems become more complicated and performance standards tighten, options to improve EMI/RFI performance becomes of great importance. Long term EMI performance and reliability are of particular importance in automotive, medical and aviation application sectors. A performance comparison will be made between single element traditional MLCC and MLV SMT devices. A second comparison will be made between 3 terminal MLCC filters and 3 terminal MLV filters using doped ZnO dielectrics. Internal designs to expand the MLVs frequency response (to higher and lower frequencies) will be presented. These range from lumping MLV/MLCCs in a single package to expand MLV frequency response to the use of non overlap electrodes to minimize internal device capacitance. The impact of sub pf MLVs will be shown through the use of eye diagrams.
