Passive Component Advancements for SPE Connectors and Circuit Protection Devices
Written By: Daniel West | Julian Wilson
Abstract:
As Single Pair Ethernet (SPE) begins to roll out there will be a need for easy to implement, yet reliable wire-to-board interconnects. Purchasing finished cable and connector assemblies is not always economical or viable. However, it is also undesirable to work with time consuming and difficult to process connectors. Insulation Displacement Connectors (IDC) and Press-Fit technology (images below) require no crimping or soldering processes, and is easily converted to a streamlined process, while maintaining the versatility of cable lengths and positioning. In addition to reliable retention forces and gas tight seals afforded by the cold weld mechanism of IDC, signal integrity is preserved and performs beyond transmission standards set for SPE connectors.
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As Single Pair Ethernet (SPE) begins to roll out there will be a need for easy to implement, yet reliable wire-to-board interconnects. Purchasing finished cable and connector assemblies is not always economical or viable. However, it is also undesirable to work with time consuming and difficult to process connectors. Insulation Displacement Connectors (IDC) and Press-Fit technology (images below) require no crimping or soldering processes, and is easily converted to a streamlined process, while maintaining the versatility of cable lengths and positioning. In addition to reliable retention forces and gas tight seals afforded by the cold weld mechanism of IDC, signal integrity is preserved and performs beyond transmission standards set for SPE connectors.
