Laser Direct Structuring (LDS): Working Principles and Benefits for RF Applications
Written By: Youssef Laamimat
Abstract:
The growing prevalence of electronic devices presents a challenge to numerous industries and markets. Addressing the industry’s need for lighter and more compact components, LDS stands out as an excellent choice. In addition, it accelerates prototype production and streamlines time-to-market. Laser Direct Structuring (LDS) technology is a revolutionary approach offering a streamlined and efficient process for creating complex 3D circuits on a myriad of substrates. LDS technology is ideal when more curves are needed or less 3D volume is available.
In RF applications such as antennas, this allows the manufacture of highly intricate designs, reduces assembly costs of having the antenna outside the device, and enhances performance while maintaining small form factors. This whitepaper by KYOCERA AVX outlines the LDS process, benefits, and key considerations, outlining its pivotal role in streamlining complex designs.
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The growing prevalence of electronic devices presents a challenge to numerous industries and markets. Addressing the industry’s need for lighter and more compact components, LDS stands out as an excellent choice. In addition, it accelerates prototype production and streamlines time-to-market. Laser Direct Structuring (LDS) technology is a revolutionary approach offering a streamlined and efficient process for creating complex 3D circuits on a myriad of substrates. LDS technology is ideal when more curves are needed or less 3D volume is available.
In RF applications such as antennas, this allows the manufacture of highly intricate designs, reduces assembly costs of having the antenna outside the device, and enhances performance while maintaining small form factors. This whitepaper by KYOCERA AVX outlines the LDS process, benefits, and key considerations, outlining its pivotal role in streamlining complex designs.
