High CV Tantalum Capacitors Challenges and Limitations
Written By: I.Horacek | T.Zednicek | S.Zednicek | T.Karnik | J.Petrzilek | P.Jacisko | P.Gregorova | I. Pinwill
Abstract:
The trend toward portable electronics is a major driving force in the need for miniaturisation of electronic components. Tantalum capacitors are becoming a product of first choice where high electrical and mechanical stability along with long service life and volumetric efficiency are demanded. The latest generation of ultra-high surface area tantalum powders in combination with an efficient constructional and encapsulation system provides a new solution for the next generation of component downsizing. This paper describes the main challenges and limitations in processes and materials that have been necessary to overcome for increased capacitance and voltage ratings. Comparison of materials and technologies and their potential development for the future are also discussed.
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The trend toward portable electronics is a major driving force in the need for miniaturisation of electronic components. Tantalum capacitors are becoming a product of first choice where high electrical and mechanical stability along with long service life and volumetric efficiency are demanded. The latest generation of ultra-high surface area tantalum powders in combination with an efficient constructional and encapsulation system provides a new solution for the next generation of component downsizing. This paper describes the main challenges and limitations in processes and materials that have been necessary to overcome for increased capacitance and voltage ratings. Comparison of materials and technologies and their potential development for the future are also discussed.
