Ceramic Capacitors

The Case for Ceramic Capacitors in Electric Vehicle DC-DC Converters Written By: John Lee | Simon Cen Abstract: The emergence and future ubiquity of electric vehicles have created one of the most demanding application spaces for capacitors across a wide variety of use cases. From AC charging circuits to high-speed analog sensors, electric vehicles span the gamut of design constraints while also requiring the highest reliability standards in the worst possible environments.

Conductive Epoxy Attachment of Capacitors Written By: Ron Demcko | Ashley Stanziola Abstract: Compared to the vast majority, capacitor attachment via conductive epoxy is not a common technique among end-user applications. A significant amount of growth in capacitor usage has occurred in solder attachment methods. Furthermore, many publications on attachment methods focus predominantly on optimizing the multiple methods of solder component attachment. Therefore, confusion exists on the requirements needed to ensure reliable long-term attachment when using conductive epoxy material systems. This paper serves as a general introduction to conductive adhesives. It aims to assist end-users in the conductive epoxy attachment of SMT (Surface Mount Technology) components.

The Pros and Cons of MLCC Downsizing Written By: Frank Hodgkinson | Maureen Strawhorne Abstract: As integrated circuits (ICs) continue to pack more functionality into smaller packages, the need for bulk off-chip capacitance remains. In resonant circuits, such as phase-lock-loops (PLLs) and switching regulators, precision class one ceramic capacitor may be required. Such capacitors must maintain a tight capacitance range over process, voltage, and temperature variation (PVT) for the host IC to meet its performance specifications. In contrast, class two ceramic capacitors are required for nearly every IC in the form of decoupling and bypass capacitance. They may also be found in amplifier circuits, simple filters, and linear regulators where their function is less dependent on tightly specified impedance requirements.

The Application of Capacitors in Power Supply Regulator Circuits Written By: Rick Liu Abstract: Advancements in electronic technology over the last decade have led to smarter consumer electronics. As devices become smarter, the components used to power them are shrinking, resulting in small, but incredibly powerful devices — ones small enough to fit inside a pocket or around a wrist. With these smaller, denser designs, it can be impossible to separate analog and digital domains in the layout, as best practices used to dictate years ago. Today, design engineers are compelled to use many capacitors in the power network to attenuate high-frequency digital noise. Circuits are designed to expect pure, clean power without noise that will impact analog circuits.

AVX MLCC Flexiterm™: Guarding Against Capacitor Crack Failures Written By: Mark Stewart Abstract: The huge popularity of MLCC capacitors in comparison with alternative technologies is primarily a result of their superb reliability record and low cost. However, in certain circumstances problems can occur due to cracking in the ceramic portion of the component. These failures result from mechanical damage caused after soldering to the PCB; normally a consequence of PCB mishandling or when the assembly is located in extreme environmental conditions. This article outlines the main benefits and features of AVX’s ‘FlexiTerm™,’ a soft termination system that minimizes these failures by relieving the mechanical stress applied to the ceramic.

Young’s Modulus and Thermal Diffusivity Measurements of Barium Titanate Based Dielectric Ceramics Written By: G. S. White and C. Nguyen National Bureau of Standards Gaithersburg, MD 20899 Bharat Rawal AVX Corporation Myrtle Beach, SC 29577 Abstract: Young’s modulus and thermal diffusivity values have been obtained on a set of barium titanate based ceramics using ultrasonic pulseecho and photoacoustic effect (PAE) measurements. The PAE was shown to detect variations in thermal diffusivity between materials of varying composition and processing treatments. The results are valuable in the evaluation of dielectric ceramic materials for practical electronics applications.

Surface Mount Soldering Techniques and Thermal Shock in Multilayer Ceramic Capacitors Written By: John Maxwell Abstract: All components used in surface mount assemblies have temperature processing limitations that must be adhered to for maximum reliability. This paper discusses multilayer ceramic capacitors in detail and soldering process considerations that are valid for all SMT components.