Vertical - Mini-TurboCap™

Features & Benefits

Unique High CV, low ESR, vertically stacked construction
Voltage Range: 25, 50 and 100V
Capacitance Range: 8.2µF to 82µF
High current handling capabilities

Typical Applications

Stress relieving lead frames provide effective mechanical decoupling of the ceramic chips from the board, minimizing the stress created by board flexing, vibration and temperature cycling

The Mini-TurboCap™ (ST10 series) is constructed from state-of-the-art BME (Base Metal Electrode) MLC Capacitors achieving very high CV, as well as ultra low ESR and ESL. This results in very large capacitance values that allow for component and board space reduction. Stress relieving lead frames provide effective mechanical decoupling of the ceramic chips from the board, minimizing the stress created by board flexing, vibration, and temperature cycling. High temperature solder is used to attach chips to the lead frame, thus eliminating the risk of solder reflow during assembly to the board.

Datasheet / Catalog