High Voltage MLC Chips Tin/Lead Termination “B” (Surface Mount)

KYOCERA AVX will support those customers for commercial and military Multi-Layer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the KYOCERA AVX Catalog Part Number. Larger physical sizes than normally encountered chips are used to make high voltage MLC chip product. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing. For 1825, 2225 and 3640 sizes, KYOCERA AVX also offers leaded version in either thru-hole or SMT configurations.